I. Instrument Overview:

The XDR-AZ350 non-destructive testing equipment utilizes the S350 digital imaging system for imaging. The microfocus X-ray tube integrates scattered radiation constraints, digital imaging, and clear image quality. The instrument features fully digital software operation capabilities, including positive/negative image selection, zoom in/out, left/right rotation, front/back rotation, flipping, digital high-definition grayscale professional image capture, Gigabit Ethernet wired and wireless connectivity, real-time computer imaging, storage, and instant printing of inspection result images.

II. Instrument Features:

The XDR-AZ350 non-destructive testing equipment is primarily designed for non-destructive testing of chips, semiconductor components, electronic components, packaged components, semiconductor devices, BGA, CPU, PCBA, IC chips, integrated circuits, connectors, heating wires, circuit boards, heating tubes, heating wires, and internal structural inspections for deformations, desoldering, voids, misalignment, etc. It can also be used for X-ray non-destructive testing of castings, die-castings, plastic injection parts, porosity, bubbles, and more.

Instrument Technical Parameters:

1. Digital Imaging Field of View: 350X430mm (customizable for different areas)

2. Pixel Pitch: 140μm

3. Distance: 300-800mm

4. A/D Conversion: 16 bits

5. Spatial Resolution: 4.0LP/mm

6. Tube Voltage: 40-120kV

7. Tube Current: 0.15-1.5mA

8. Computer System: Windows 10

9. Computer Size: 16-inch desktop computer (wired/wireless connectivity)

10. Remote Control: Remote operation software

11. Wired Transmission Port: Gigabit Ethernet port

12. Wireless Transmission: 5G Wi-Fi

13. Dimensions: 1350×800×720mm

14. Unit Weight: 210kg

15. Adapter Output Voltage: DC24V

16. AC Power Frequency: 50-60Hz