Thermistor Capacitance Detection Equipment Encapsulated Component Chip X-RAY Non-Destructive Testing Equipment

I. Instrument Introduction:

The XDR-AZ350 non-destructive testing equipment utilizes the s350 digital imaging system for imaging. The microfocus X-ray tube integrates scattered radiation constraints, digital imaging, and clear images. The instrument features fully digital software operation functions, including positive/negative image selection, image zoom in/out, left/right rotation, front/back rotation, flipping, digital high-definition grayscale professional image capture, Gigabit Ethernet wired and wireless connectivity, real-time computer imaging, storage, and instant printing of test result images.

II. Instrument Features:

The X-RAY non-destructive testing equipment is primarily used for non-destructive testing of chips, semiconductor components, electronic components, encapsulated components, semiconductor devices, BGA, CPU, PCBA, IC chips, integrated circuits, connectors, heating wires, circuit boards, heating tubes, heating wires, and internal structures of electronic products to detect deformations, desoldering, void soldering, shifts, etc. It can also be used for X-RAY non-destructive testing of castings, die-castings, injection moldings, pores, bubbles, etc.

Instrument Technical Parameters:

1. Digital Imaging Field of View: 350X430mm (customizable for different areas)

2. Pixel Pitch: 140um

3. Distance: 300-800mm

4. A/D Conversion: 16/bits

5. Spatial Resolution: 4.0LP/mm

6. Tube Voltage: 40-120kV

7. Tube Target Current: 0.15-1.5mA

8. Computer System: Windows 10

9. Computer Size: 16-inch desktop computer (wired and wireless connectivity)

10. Remote Control: Remote operation software

11. Wired Transmission Port: Gigabit Ethernet port

12. Wireless Transmission: 5G Wi-Fi

13. Dimensions: 1350×800x720mm

14. Host Weight: 210kg

15. Adapter Output Voltage: DC24V

16. AC Power Frequency: 50-60Hz