Indium10.8HF is a no-clean solder paste suitable for air reflow, specifically designed to meet the requirements of higher process temperature alloy systems such as SnAgCu and SnAg, commonly used in the electronics industry. It is also compatible with other alloy systems that can replace traditional lead-containing solders. Indium10.8HF offers excellent stencil transfer efficiency and can be used under various process conditions.

Features ? Excellent anti-NWO capability ? Wide reflow process window in both air and nitrogen atmospheres ? Outstanding resistance to Head-In-Pillow (HIP) defects ? High solderability and yield rate - Superior wetting performance on all fresh and aged surfaces, such as: ? OSP ? Immersion Silver ? Immersion Tin ? ENIG - Minimal solder bridging, tombstoning, and solder balling - Low voiding rates in all solder joints, including QFN and BGA assemblies ? Transparent residue after reflow