Indium5.7LT-1 is a no-clean, halogen-free solder paste compatible with air reflow, specifically designed for processes utilizing bismuth-based and indium-based low-temperature alloys. This
solder paste offers excellent wetting and transparent residues. Its activation at low temperatures enables efficient low-temperature lead-free soldering solutions when paired with SnBi alloys.

Features
? Low-temperature lead-free solution
? Outstanding and highly consistent printing performance
? Transparent residue
? Minimizes solder bead and ball formation
? Excellent wetting performance in both air and nitrogen reflow environments
? Halogen-free as per EN14582 test