Horizontal Pollution-Free Submicron Ultrafine Grinder

Price:Negotiable

Industry Category:	Machinery & Industrial Equipment
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宜興精新粉體設(shè)備科技有限公司

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Add:宜興丁蜀鎮(zhèn)陶瓷產(chǎn)業(yè)園區(qū)川埠路30號(hào), Zip: 214222
Contact: 夏桂梅
Tel:0510-87499201
Email:yxjxft@sina.com

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Main Structure
    The LSG series of pollution-free submicron ultrafine grinders integrate multiple advantages of modern grinding machinery, representing advanced contemporary models. The main structure consists of the machine body, grinding spindle (equipped with multiple sets of S-shaped corundum ceramic blades), grading wheel section, motor drive section, automatic control section, automatic feeding section, cyclone collection, and exhaust section.
     Working Principle
    The material to be ground is evenly fed into the machine body’s feed inlet via an automatic feeder. Inside the machine, an appropriate amount of grinding media—such as zirconia microbeads, alumina microbeads, or silica microbeads (selected based on grinding product requirements)—is loaded. After startup, the spindle drives multiple sets of S-shaped ceramic blades (e.g., 13 sets in the 400 model) to rotate, causing the media and material to be thrown and dispersed within the machine. This results in high-speed collisions and grinding between the media beads, refining the material. The refined material is lifted by the negative pressure created by the high-pressure blower in the exhaust section and, assisted by the airflow from the grading wheel, is transported to the collection system.
    Main Features
1. The flow path and grinding components are made of highly wear-resistant 99% alumina, ensuring no contamination of any ground material and maintaining the quality of high-purity substances.
2. Direct motor-driven grinding results in low energy consumption, using only 30% to 50% of the energy required by equipment of similar capacity.
3. Grinding is the primary mechanism, producing spherical particles without edges and with high bulk density.
4. Variable frequency speed control allows processing of products with various hardness and fineness requirements.
    Main Applications
    Primarily used for high-end materials such as electronic materials, lithium battery cathode and anode materials, trichromatic phosphors, LED luminescent materials, pharmaceutical raw materials, and other high-tech, high-purity oxide materials requiring ultrafine grinding (submicron level).
    Main Specifications and Technical Parameters: