Our company is located in Dongguan, Guangdong, and Suzhou, Jiangsu, specializing in the production of ceramic capillaries, which can be used for chip packaging of various aperture sizes. They fully replace imported products and offer high cost-effectiveness. Welcome to inquire.
Ceramic capillaries are widely used in semiconductor IC packaging and LED packaging, serving as a key core tool in the packaging process. Ceramic capillaries are used as bonding tools in the wire bonding process and can be applied to the bonding and packaging of circuits such as thyristors, surface acoustic wave devices, LEDs, diodes, transistors, and IC chips. The main products provide electrical connections between the chip and external systems, offer a stable and reliable working environment for the chip, provide mechanical and environmental protection for integrated circuit chips, and offer thermal pathways to ensure proper heat dissipation. In semiconductor processes, packaging is one of the most critical steps, with "wire bonding" being the primary method used to achieve circuit connections between the chip and the substrate. In this process, one indispensable tool is the ceramic capillary. Welcome to inquire, support, and collaborate.