High-Temperature and High-Humidity Resistant Epoxy Structural Sealant for Power Semiconductor Ceramic Packaging

Case Name: High-Temperature and High-Humidity Resistant Epoxy Structural Sealant for Power Semiconductor Ceramic Packaging 

Application Point: Power semiconductor ceramic packaging, bonding ceramic lids to the metal frame at the bottom. Similar to applying glue along the rim of a cup and then pressing a metal plate (gold-plated) onto it for adhesion. The lid dimensions are 20x9mm, with a sidewall thickness of 0.7mm.

High-Temperature and High-Humidity Resistant Epoxy Structural Sealant for Power Semiconductor Ceramic Packaging

Application Point Images:

Requirements:

Must meet PCT conditions (121°C, 100% humidity, 2.3 kg pressure, 168 hours).

TC: -65°C to 150°C, one cycle per half hour, run 500 cycles. The adhesive must withstand three reflow cycles at 260°C.

After completing the aging tests, the product must maintain its airtightness (the adhesive is used to bond the ceramic lid to the metal frame in a cavity product). Fluorinated oil test conditions: immerse in fluorinated oil at 125°C for 1 minute, then check for air leakage.

Solution: Single-component high-temperature and high-humidity resistant epoxy adhesive

High-Temperature and High-Humidity Resistant Epoxy Structural Sealant for Power Semiconductor Ceramic Packaging