Plastic Research Institute Die-Attach Conductive Silver Adhesive DAD-87

Product Name: Synthetic Resin Research Institute Die-Attach Conductive Silver Adhesive for IC Packaging Chip Bonding DAD-87

Application Point: Chip Bonding

Product Features:

DAD-87 conductive adhesive is a solvent-based, single-component silver epoxy conductive adhesive. After curing, it exhibits excellent bonding strength, electrical conductivity, heat resistance, and low impurity ion content. It is suitable for bonding in plastic-encapsulated integrated circuits, small to medium power transistors, light-emitting diodes (LEDs), PTC ceramic heating elements, and more.

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Plastic Research Institute Die-Attach Conductive Silver Adhesive DAD-87