AIT Conductive Silver Adhesive ME8456

Product Name: American AiT Flexible Single-Component Epoxy Conductive Silver Adhesive for Chip Bonding ME8456

Application: Chip or component bonding

Product Features:

ME8456 is a reworkable, pure silver-filled, electrically and thermally conductive flexible epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE (e.g., alumina to aluminum, silicon to copper). Due to its ability to bond materials with highly mismatched CTE, it is highly suitable for applications such as large-area die attachment and substrate bonding. Complies with Mil Std 883 and NASA-ESA outgassing requirements.

AIT Conductive Silver Adhesive ME8456