Case Name: Domestic QMI2569 Silver Glass Conductive Silver Paste for Chip Packaging Glass Sealing

Application Fields and Requirements: Integrated circuit packaging, IC glass sealing process, short-term high-temperature resistance above 400°C, can replace imported QMI2569 and QMI3555R

Application Point Image:

Solution: Domestic 1023GA Silver Glass Conductive Silver Paste

Product Introduction

This product is a sintered silver glass conductive adhesive, utilizing high-performance materials and advanced manufacturing processes. It features high thermal conductivity, high electrical conductivity, and excellent moisture resistance.

Application: The product can be used for bonding or metallization of materials such as gold, silver, aluminum, glass, and ceramics.

Materials and Properties

1. Main Components: Silver powder, glass, organic carrier

2. Product Performance

*Crush 5  grams of sample to less than 80   mesh, then add 50  grams of deionized water and reflux at 100°C for 24 hours.

2. Curing Method

Select an appropriate heating rate based on the chip size. The following curing procedure is recommended:

1) Heat from room temperature to 420°C at a rate of 3-10°C/min.

2) Maintain at 420°C for 8-10 minutes;

3) Cool down to room temperature over a period of 20 minutes or more.

3. Bondable Materials

Gold, silver, silicon, ceramics