HUSTEC-HTGB High Temperature Gate Bias System places the device under test in a specific ambient temperature and applies a certain bias voltage to the gate of the device. The system monitors the leakage current and voltage of each material in real time. When the real-time leakage current of the material under test exceeds the set value, the voltage on the material is automatically cut off.

Brand: HUSTEC
Name: HTGB High Temperature Gate Bias Test System
Model: GKH-HTGB-C16

Product Details

★ Main Technical Specifications and Performance:
Product Model: GKH-HTGB-C16
Product Name: High Temperature Gate Bias Test System
High Temperature Test Chamber: One PH-201 High Temperature Test Chamber
Test Areas: 16
Test Capacity: 80 positions per channel, 16 channels in total.
Test Power Supply: Optional TDK Z+ series power supply or Agilent test power supply.
Number of Power Supplies: Configure 4 or 8 power supplies.
Output Range: 0～35V or 0～60V.
Main Functions: ① Normal HTGB test, positive or negative gate voltage can be selected via button; only one bias voltage can be active at a time, not both simultaneously.
② Thermal resistance measurement, i.e., measuring the Tj value during HTGB operation.
③ The high temperature test chamber can accommodate 4-layer or 8-layer boards. Specifics depend on the package size of the device. When the measured module is too large, the number of devices under test must be reduced accordingly due to volume limitations.
④ Optional high temperature test chamber with a maximum temperature of 300°C.
Measurement and Control Functions: ① Monitor the voltage and leakage current of each material.
② Leakage current over-limit protection, automatically cutting off the measurement circuit.
③ Measurement current range: 1nA～100uA;
④ Current resolution: 0.5nA;
⑤ Measurement accuracy: ±2%±3nA;
Anti-static Design: ① Equipment casing is well grounded;
② Reserved electrostatic grounding terminal (banana jack) for easy connection of an electrostatic ring by the operator.
Computer: Industrial-grade computer host, LCD monitor, dedicated keyboard, and mouse. Windows operating interface, user-friendly human-machine dialogue window, powerful graphic editing capabilities, and an extensive device library for user selection. The software is easy to operate and learn. Additionally, it features system query and diagnostic functions, making test conditions clear at a glance and convenient for users to check at any time.
Aging Board: Customizable aging boards according to customer device packaging.
Power Grid Requirements: Single-phase AC220V±10%, 47Hz~63Hz, 6KW
Dimensions: W1360mm x H1820mm x D1320mm
Weight: Approximately 500kg

Introduction to HTRB/HTGB Testing

High Temperature Reverse Bias Test (HTRB) is a working mode where reverse bias is applied at high temperatures. Due to increased leakage current at high temperatures, poor-quality devices will fail, thereby assessing product reliability.

Test Temperature: 125°C, 150°C, or 175°C.

Test Duration: 168h, 500h, 1000h.

Test Purpose: To study the effect of bias conditions and temperature over time on solid-state devices operating under the highest rated reverse DC voltage or 80% of the highest rated reverse DC voltage in static working mode.

Reference Test Standard: JESD22-A108



High Temperature Gate Bias Test (HTGB) is primarily used to determine the reliability of the gate oxide itself and related interfaces.

Test Temperature: 150°C or 175°C.

Test Duration: 500h, 1000h.

Reference Test Standard: JESD22-A108

HTRB and HTGB are the most common test items in reliability testing.

Applicable Test Devices: Power diodes, SiC Schottky and Schottky diodes, thyristors, triacs, and IGBTs.

Test Equipment: High Temperature Reverse Bias Test Machine