Product Identification: CAS No.: 2426-08-06 Molecular Formula: C4H9OCH2 (CHCH2) O Specification: 1、APPEARANCE：CLEAR, COLOURLESS, OILY LIQUID 2、VISCOSITY ( 25℃, MPA?S)：≤2 3、EPOXY VALUE (EQ/100G)：≥0.65 4、ORGANOCHLORINE (EQ/100G)：≤0.01 5、INORGANIC CHLORINE (EQ/100G)：≤0.001 6、COLOR (APHA)：≤10 7、MOISTURE (%)：≤0.1 Packing: 1.Packing Material: Plastic Drum or Iron Drum 2.Net Weight: 180kg/drum Application: It can be widely used to electronics, electrical equipment, electromechanical and machinery industry. Low viscosity can greatly lower the viscosity of epoxy resin and improve its usability. It’s suitable for embedment, casting, lamination, impregnation and other applications. It can be used as insulating material and bonding material, also in the application of solventless coatings and adhesives.
It can be widely used to electronics, electrical equipment, electromechanical and machinery industry. Low viscosity can greatly lower the viscosity of epoxy resin and improve its usability. It’s suitable for embedment, casting, lamination, impregnation an

CAS NO:2426-08-6

EC NO:219-376-4

Molecular Formula:C₇H₁₄O₂

Molecular Weight:130.1849

Synonyms:;Butyl 2,3-epoxypropyl ether;Glycidol butyl ether;NBGE;Butoxymethyloxirane;2-(butoxymethyl)oxirane;(2R)-2-(butoxymethyl)oxirane;

Molecular Structure:

CAS NO:2426-08-6

EC NO:219-376-4

Molecular Formula:C₇H₁₄O₂

Molecular Weight:130.1849

Synonyms:;Butyl 2,3-epoxypropyl ether;Glycidol butyl ether;NBGE;Butoxymethyloxirane;2-(butoxymethyl)oxirane;(2R)-2-(butoxymethyl)oxirane;

Molecular Structure: