1.Characteristics

J-STD-004/B Class Zero Halogen/Halide

RoHS Compliant

Cleanable with Deionized Water

Low Foaming

T4 and T5 Alloys Available

Stencil Life Exceeds 8 Hours

Extended Cleaning Window Over 2 Weeks

2.Description

AIM W20 SAC305 water-soluble solder paste features a zero halide/halogen flux formulation. W20 is specifically developed to enhance wetting performance on all solderable electronic surfaces. It offers excellent printability and stencil life exceeding 8 hours. The highly soluble residues of W20 are easily removed in plain water, even with fine-pitch components. This versatile water-soluble product meets the industry's demand for stable and reliable halogen-free water-soluble solder paste.

3. Handling and Storage

Do not mix used solder paste with unused solder paste. Store separately; ensure the inner lid or top cover is securely closed and resealed for unused paste. The shelf life after opening depends on environmental and application conditions. For details, refer to the AIM Solder Paste Handling Guide. Alloy composition and storage conditions may affect shelf life. Consult the W20 Certificate of Analysis for specific information.

4. Cleaning

Pre-reflow: AIM DJAW-10 is effective for cleaning W20 solder paste. DJAW-10 can be used for automated or manual stencil wiping. It does not dry out W20 but enhances its printability. Avoid excessive use of DJAW-10. Do not apply DJAW-10 to the top of the stencil. Isopropyl alcohol (IPA) is not recommended during the process and should only be used for final cleaning. Post-reflow residues: AIM recommends removing W20 flux residues within 24 hours for optimal results, but they can remain on the board for up to two weeks. Cleaning can be performed in pure water at 50°C-60°C (120°F-140°F), followed by a final rinse in deionized water.