1. Overview

AIM H10 SAC305 lead-free and halogen-free solder paste is a high-performance welding material with exceptional activity and high SIR value in post-soldering residues. It is primarily used for precision soldering of electronic components. Its excellent wettability eliminates false soldering (HiP) defects and improves coverage on various surface-treated pads. Free of lead and halogens, it meets environmental requirements while offering good fluidity and soldering performance.

2. Pre-operation Preparation

Material Check: Ensure the packaging of AIM H10 SAC305 solder paste is intact and within its validity period.

Equipment Calibration: Inspect the status of the reflow soldering equipment to ensure normal operation.

Environment Preparation: Maintain a clean working environment to avoid the impact of dust and moisture on soldering quality.

Personal Protection: Wear appropriate protective clothing, gloves, and masks to ensure operator safety.

3. Usage of Solder Paste

Opening and Stirring: After the solder paste has returned to room temperature for 4 hours, stir it thoroughly to ensure the powder and solvent are fully mixed. Use a dedicated stirrer to avoid contamination from metal debris or other impurities.

4. Printing

Place the stirred solder paste into the material cup of the printing machine; adjust equipment parameters such as solder volume, printing speed, and path to accommodate different soldering needs, ensuring the solder paste is evenly applied to the soldering areas of the PCB board.