Optorun Magnetron Sputtering Machine OWLS-1800 Coater

Detailed Introduction:

The OWLS-1800 is a metal-mode sputtering system specifically designed for "semiconductor optical devices," suitable for 12-inch wafers. This sputtering system can expand application ranges (simultaneous double-size coating, low-temperature coating, etc.)

Sales Technical Manager Yang: 181-030-45976  

Features:

Suitable for various wafer sizes (12", 10", 8", 6", and 4")

Vacuum wafer handling robot for fast and clean transfer system

3 dual-rotating cylindrical cathodes

Highly reactive plasma source for low-absorption films

Additional modules, such as optical thickness monitor (optional)

Compatible with EFEM and compliant with SEMI standards

Specifications:

Vacuum Chamber

Load-lock chamber: Width 820mm × Height 1455mm × Depth 740mm

Transfer chamber: Width 1070mm × Height 480mm × Depth 1070mm

Process chamber: Width 2540mm × Height 745mm × Depth 2285mm

Substrate Holder

10 pieces (maximum 12-inch)

Substrate Rotation Drum System

Diameter 1800mm × Height 48mm, drum type, 10 rpm-100 rpm (adjustable)

Reaction Source

ICP (Inductively Coupled Plasma)

Sputtering Source

Dual rotating cathode (optional planar target)

Vacuum System

Roughing pump, molecular pump, cold trap

Performance:

Ultimate Pressure

Load-lock chamber: 10Pa

Process chamber: ≤5.0 × 10??Pa

Pumping Speed

Load-lock chamber, transfer chamber: 5 minutes (from atmosphere to 10Pa)

Process chamber: ≤40 minutes (from atmosphere to 5.0×10?3Pa)

Operating Conditions:

Equipment Dimensions

6500mm (width) × 6000mm (depth) × 3400mm (height)

Power Supply

3-phase + G, 380V±5%, 125kVA, 50/60Hz

Water Flow Rate

≥195 liters/minute

Air Pressure

0.5 MPa - 0.7 MPa

Total Weight

Approximately 13500 kg