Firstly, the spherical powder has excellent surface fluidity, mixes uniformly with resin to form a film, requires a small amount of resin addition, and exhibits the best fluidity. The filler loading of the powder can reach the maximum, with a weight ratio of up to 90.5%. Therefore, spheroidization means an increase in the filler loading of silica micro powder. The higher the filler loading of silica micro powder, the lower its coefficient of thermal expansion and thermal conductivity, making it closer to the coefficient of thermal expansion of monocrystalline silicon. As a result, the performance of electronic components produced with it is superior. Secondly, the molding compound made from spherical powder has the least stress concentration and the highest strength. When the stress concentration of angular powder molding compound is 1, the stress of spherical powder is only 0.6. Therefore, when spherical powder molding compound is used to encapsulate integrated circuit chips, the yield rate is high, and mechanical damage is less likely to occur during transportation, installation, and use. Thirdly, spherical powder has a low friction coefficient and causes less wear on molds, extending their service life. Compared with angular powder, it can double the service life of molds. The cost of molding compound encapsulation molds is very high, and some even need to be imported. This is also important for encapsulation factories to reduce costs and improve economic efficiency.