Copper
Contact Info
- Address:杭州市艮山西路214號(hào)營(yíng)業(yè)部, Zip: 310004
- Contact: 倪銀君
- Tel:0571-86944399 86015501
- Email:jinliupin@163.com
Other Products
CAS NO:7440-50-8
EC NO:231-159-6
Molecular Formula:Cu
Molecular Weight:63.5449
Synonyms:;C.I. 77400;C.I. Pigment Metal 2;Copper;copper coating quality balzers;Copper ingot;raney-copper ready for use;Raney-Copper;Copperpowderdendritic;CopperrodNmmdiacElectrolytic copperagcm;CoppershotNmmdia;CopperturningsN;CopperfoilNmmthickxmmwide;Copperwireclothmeshmmwidemmwiredia;Copperwiremmdia;Copperwiresreducedfromoxide;CopperpowderNmesh;Copperpowdersphericalmesh;Copperpowdermeshunderargon;CopperwireNmmdia;CopperfoilNmmthick;CoppershotNmm;Copper powder;Copper, small rods for elemental analysis;Copper (S, P);Electrolytic tough pitch copper (O);Copper (O);Continuous cast copper (O);Electrolytic copper (trace elements);Copper with added impurities (trace elements);Copper foil(99.9%);Copper wire (99.99) 0.25mm dia.;Bronze, powder;Copper wire (99.999%) 0.76mm dia.;Copper wire cloth;Copper foil (99.9985%);Copper foil(99%);Copper shot(99.9) 1-10mm;Copper shot(99.999%) 2-8mm;Copper metal foil;Copper turnings;Copper metal wire;Copper solution 1000 ppm;Copper solution 10 000 ppm;Electrolytic copper;Sponge copper;Copper nanopowder;copper(2+);
Molecular Structure:
CAS NO:7440-50-8
EC NO:231-159-6
Molecular Formula:Cu
Molecular Weight:63.5449
Synonyms:;C.I. 77400;C.I. Pigment Metal 2;Copper;copper coating quality balzers;Copper ingot;raney-copper ready for use;Raney-Copper;Copperpowderdendritic;CopperrodNmmdiacElectrolytic copperagcm;CoppershotNmmdia;CopperturningsN;CopperfoilNmmthickxmmwide;Copperwireclothmeshmmwidemmwiredia;Copperwiremmdia;Copperwiresreducedfromoxide;CopperpowderNmesh;Copperpowdersphericalmesh;Copperpowdermeshunderargon;CopperwireNmmdia;CopperfoilNmmthick;CoppershotNmm;Copper powder;Copper, small rods for elemental analysis;Copper (S, P);Electrolytic tough pitch copper (O);Copper (O);Continuous cast copper (O);Electrolytic copper (trace elements);Copper with added impurities (trace elements);Copper foil(99.9%);Copper wire (99.99) 0.25mm dia.;Bronze, powder;Copper wire (99.999%) 0.76mm dia.;Copper wire cloth;Copper foil (99.9985%);Copper foil(99%);Copper shot(99.9) 1-10mm;Copper shot(99.999%) 2-8mm;Copper metal foil;Copper turnings;Copper metal wire;Copper solution 1000 ppm;Copper solution 10 000 ppm;Electrolytic copper;Sponge copper;Copper nanopowder;copper(2+);
Molecular Structure:
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